KUALA LUMPUR: The inaugural Institute of Future Technology and Design (IFTD) Forum and Workshops, a collaboration between HELP University and China‘s top-ranked packaging institution, Hunan University of Technology (HUT) will take place from Aug 23 – 27 at HELP University’s campus here.
This initiative represents a strategic alliance to advance innovation, sustainability and human-centric development in the circular economy.
In 2025, HUT and HELP University are launching the Institute of Future Technology and Design (IFTD) at HELP University, establishing South-East Asia’s premier hub for sustainable packaging R&D and talent cultivation.
This pioneering alliance brings together China‘s leading packaging technology expertise with Malaysia’s innovative educational leadership to address one of this era’s most critical challenges: rethinking packaging and design for ecological resilience, technological progress and inclusive growth.
These forums and workshops will explore seven key themes that merge ecology, technology and creativity to replace linear waste with circular regeneration.
The sessions will cover a range of topics, from Sustainable Materials and Eco-Design, focusing on bio-based and recyclable innovations, to Smart Packaging that utilises technologies like QR/RFID, sensors and supply-chain transparency.
The discussions will also delve into Circular Design, with a focus on assessing product lifecycle impacts and the implementation of regenerative systems.
Additionally, the Forum will explore the integration of Artificial Intelligence (AI) and Green Manufacturing, highlighting key topics such as automation, digital twins and low-energy production methods.
Consumer Engagement will also be a major area of exploration, addressing critical issues such as branding, ethics and the promotion of sustainable behaviour.
Additionally, the discussions will address Policy and Governance, including EPR and public-private models and Talent Development, focusing on the future-ready, cross-disciplinary training.
The forum aims to drive transformation across four critical areas, such as Talent Development by equipping the next generation of sustainability leaders, helping Business Transformation by converting circular packaging into competitive advantage.
The event will also explore Technology Adoption, focusing on scaling AI, the Internet of Things (IoT) and automation for eco-innovation. Finally, it will address Ecological Repair, concentrating on designing systems that restore nature.
Their vision extends beyond national boundaries. Malaysia and Asean, positioned at the nexus of China‘s industry and regional dynamism, can lead Asia’s green transformation in alignment with national and regional sustainability goals.
This forum represents Malaysia’s opportunity to play a central role in the ecology of technology design and packaging.
The IFTD Partnership offers unprecedented collaboration opportunities in co-developing courses in packaging innovation and sustainability, credit transfer, degree collaboration, exchanges and joint laboratories, a China-Malaysia innovation corridor for R&D and start-ups as well as training and study visits to China’s AI institutions and technology hubs.
As a leader in the design technology and packaging industry, the expertise and perspective of the targeted audience are invaluable to achieving the shared vision.
The forum provides an exceptional platform to connect globally with academia, industry and government leaders across borders. It also serves as an opportunity to showcase innovation by presenting cutting-edge research in design, packaging and sustainability.
It also provides a platform to build partnerships by developing strategic alliances for circular economy solutions, access to talents with connections to the next generation of sustainability professionals, and lastly, the opportunity to influence policy to shape the future of sustainable packaging standards and practices.
Under the visionary leadership of HUT and HELP University, this initiative represents more than a forum — it seeds a future where packaging regenerates, technology serves ecology, and collaboration builds a humane, sustainable world.
Event details
Forum: The Application of AI in the Design Industry
- Date: Aug 23
- Time: 9am – 1pm
- Venue: Level 4, Auditorium, Wisma CL, Kuala Lumpur
- Speaker: Prof Heping Zhu, Dean of the College of Packaging Design and Art at Hunan University of Technology
- Fee: RM216 (RM200 + 8% SST)
Workshop 1: AI Applications to Improve Productivity and Profitability (2 Days)
- Date: Aug 25-26
- Time: 9.30am – 5.30pm
- Venue: Level 9, HELP University, ELM Business School, Kuala Lumpur
- Fee: RM2,700 (RM2,500 + 8% SST)
Early Bird: 50% discount for registrations before August 15, 2025
Workshop 2: Use of Technology for Sustainable Packaging (3 Days)
- Date: Aug 25-27
- Time: 9.30am – 5.30pm
- Venue: Level 9, HELP University, ELM Business School, Kuala Lumpur
- Fee: RM5,940 (RM5,500 + 8% SST)
Early Bird: 50% discount for registrations before August 15, 2025
Exhibition: Award-Winning Concepts in Eco-Design, Smart Packaging and Circular Innovation
- Date: Aug 23-27
- Time: 9.30am – 5.30pm
- Venue: Level 4, Wisma CL, Kuala Lumpur
- Free Admission
Special Offer: Register for either workshop and attend the forum at no additional charge.
For registration and inquiries:
- Dr Fiona: 017-306 6300
- Dr Alice Lim: 012-332 0179
- Liz Quah: 012-267 2378
