KUALA LUMPUR: Kelington Group Bhd has secured a contract worth S$33 million (about RM108 million) from a turnkey engineering specialist for works related to an advanced packaging facility project in Singapore.
In a filing with Bursa Malaysia, the group said its wholly-owned subsidiary, Kelington Engineering (S) Pte Ltd (KESG), was awarded the contract on Sept 22.
Under the deal, KESG will undertake the bulk gas distribution piping system for the facility, which is being developed for a leading global memory chip manufacturer.
“Work will begin immediately and is expected to be completed by December 2026, upon issuance of the final completion certificate by the project owner,” the group said.
Kelington added the project is expected to contribute positively to its earnings and net assets for the financial years ending Dec 31, 2025, and Dec 31, 2026.
© New Straits Times Press (M) Bhd
